Besi

BESI · XAMS · Netherlands

Makes machines that attach and stack chips, including hybrid bonders.

▲ For · Hybrid bonding enters HBM by end-2027 →

▲ / ▼ / ● = past events on the chart · Price in EUR · Bars = volume

Financials

orders · Q1-26: 269.7 EUR m
orders · Q2-26: 292.9 EUR m
orders · LTM Q2-26: 987.6 EUR m
hybrid_bonding_customers · Q2-26: 21 count

In these theses

▲ For

Hybrid bonding enters HBM by end-2027

Leading maker of hybrid bonders; sells the integrated Kinex system with Applied Materials. One memory maker is evaluating its tools. Gains most if a memory maker switches in volume.